AWS CloudHSM 支援 FIPS 140-2 Level 3 了

AWS CloudHSM 推出了一些新功能:「AWS CloudHSM Update – Cost Effective Hardware Key Management at Cloud Scale for Sensitive & Regulated Workloads」。

其中比較特別的是從以前只支援 Level 2 變成支援 Level 3 了:

More Secure – CloudHSM Classic (the original model) supports the generation and use of keys that comply with FIPS 140-2 Level 2. We’re stepping that up a notch today with support for FIPS 140-2 Level 3, with security mechanisms that are designed to detect and respond to physical attempts to access or modify the HSM.

在維基百科裡面有提到 Level 2 與 Level 3 的要求:

Security Level 2 improves upon the physical security mechanisms of a Security Level 1 cryptographic module by requiring features that show evidence of tampering, including tamper-evident coatings or seals that must be broken to attain physical access to the plaintext cryptographic keys and critical security parameters (CSPs) within the module, or pick-resistant locks on covers or doors to protect against unauthorized physical access.

In addition to the tamper-evident physical security mechanisms required at Security Level 2, Security Level 3 attempts to prevent the intruder from gaining access to CSPs held within the cryptographic module. Physical security mechanisms required at Security Level 3 are intended to have a high probability of detecting and responding to attempts at physical access, use or modification of the cryptographic module. The physical security mechanisms may include the use of strong enclosures and tamper-detection/response circuitry that zeroes all plaintext CSPs when the removable covers/doors of the cryptographic module are opened.

主動式偵測以及銷毀算是 Level 3 比 Level 2 安全的地方。

另外就是計價方式的修正,先前有一筆固定的費用,現在變成完全照小時計費了:

Pay As You Go – CloudHSM is now offered under a pay-as-you-go model that is simpler and more cost-effective, with no up-front fees.

This entry was posted in AWS, Cloud, Computer, Hardware, Murmuring, Network, Security, Service and tagged , , , , , , , , , , , , . Bookmark the permalink.

Leave a Reply

Your email address will not be published. Required fields are marked *